The Thermal Load Options dialog box contains advanced options for creating or modifying thermal studies. You can open the dialog box using the Thermal Load Options button in the Create Study (or Modify Study) dialog box. You can set default values for these options using the Simulation tab in the Solid Edge Options dialog box.

Radiation

Enclosure Ambient Element

For a radiation enclosure load, specifies the ambient temperature within the enclosure.

Values can be from -1e+09 to 1e+09.

Free Convection

Alternate Formulation

When checked, specifies that the Alternate method is used to determine the free convection exponent.

The Standard method and the Alternate method are defined by the following equations.

Standard method

Alternate method

Variables	Definition
q	Heat transfer rate
h	Free convection heat transfer coefficient
u CTRLND	Temperature (of the control node) for time-dependent heat transfer coefficient
T	Temperature (surface or internal)
T AMB	Temperature (ambient or surrounding
EXPF	Convection exponent

Note:

These options are used by NX Nastran and MSC.Nastran. To learn more about them, refer to the NX Nastran documentation.

Convection Exponent

Specifies the exponent to use when calculating the alternative convection temperature format.

Values can be from -9.99E+30 to 9.99E+30.

Note:

The Convection Exponent is the value shown as EXPF in the above equations.